外贸术语缩写,计算机缩写术语完全介绍

计算机缩写术语完全介绍 - 电脑术语 - 电脑教程网

计算机缩写术语完全介绍

日期:2007-09-21   荐:

 英文术语完全介绍
在每组术语中,我按照英文字母的排列顺序来分类。

1、CPU
3DNow!(3Dnowaiting,无须等待的3D处理)
AAM(AMDAnalystMeeting,AMD分析家会议)
ABP(AdvancedBranchPrediction,高级分支预测)
ACG(AggressiveClockGating,主动时钟选择)
AIS(AlternateInstrUCtionSet,交替指令集)
ALAT(advancedloadtable,高级载入表)
ALU(ArithmeticLogicUnit,算术逻辑单元)
Aluminum(铝)
AGU(AddressGenerationUnits,地址产成单元)
APC(AdvancedPowerControl,高级能源控制)
APIC(AdvancedrogrammableInterruptController,高级可编程中断控制器)
APS(AlternatePhaseShifting,交替相位跳转)
ASB(AdvancedSystemBuffering,高级系统缓冲)
ATC(AdvancedTransferCache,高级转移缓存)
ATD(AssemblyTechnologyDevelopment,装配技术发展)
BBUL(BumplessBuild-UpLayer,内建非凹凸层)
BGA(BallGridArray,球状网阵排列)
BHT(branchpredictiontable,分支预测表)
Bops(BillionOperationsPerSecond,10亿操作/秒)
BPU(BranchProcessingUnit,分支处理单元)
BP(BrachPediction,分支预测)
BSP(BootStrapProcessor,启动捆绑处理器)
BTAC(BranchTargetAddressCalculator,分支目标寻址计算器)
CBGA(CeramicBallGridArray,陶瓷球状网阵排列)
CDIP(CeramicDual-In-Line,陶瓷双重直线)
CenterProcessingUnitUtilization,中央处理器占用率
CFM(cubicfeetperminute,立方英尺/秒)
CMT(course-grainedmultithreading,过程消除多线程)
CMOS(ComplementaryMetalOxideSemiconductor,互补金属氧化物半导体)
CMOV(conditionalmoveinstruction,条件移动指令)
CISC(ComplexInstructionSetComputing,复杂指令集计算机)
CLK(ClockCycle,时钟周期)
CMP(on-chipmultiprocessor,片内多重处理)
CMS(CodeMorphingSoftware,代码变形软件)
co-CPU(cooperativeCPU,协处理器)
COB(Cacheonboard,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))
COD(CacheonDie,芯片内核集成缓存)
Copper(铜)
CPGA(CeramicPinGridArray,陶瓷针型栅格阵列)
CPI(cyclesperinstruction,周期/指令)
CPLD(CompleXProgrammableLogicDevice,複雜可程式化邏輯元件)
CPU(CenterProcessingUnit,中央处理器)
CRT(CooperativeRedundantThreads,协同多余线程)
CSP(ChipScalePackage,芯片比例封装)
CXT(ChoopereXTend,增强形K6-2内核,即K6-3)
DataForwarding(数据前送)
dB(decibel,分贝)
DCLK(DotClock,点时钟)
DCT(DRAMController,DRAM控制器)
DDT(DynamicDeferredTransaction,动态延期处理)
Decode(指令解码)
DIB(DualIndependentBus,双重独立总线)
DMT(DynamicMultithreadingArchitecture,动态多线程结构)
DP(DualProcessor,双处理器)
DSM(DedicatedStackManager,专门堆栈管理)
DSMT(DynamicSimultaneousMultithreading,动态同步多线程)
DST(DepletedSubstrateTransistor,衰竭型底层晶体管)
DTV(DualThresholdVoltage,双重极限电压)
DUV(DeepUltra-Violet,纵深紫外光)
EBGA(EnhancedBallGridArray,增强形球状网阵排列)
EBL(electronbeamlithography,电子束平版印刷)
EC(EmbeddedController,嵌入式控制器)
EDEC(EarlyDecode,早期解码)
EmbeddedChips(嵌入式)
EPA(edgepinarray,边缘针脚阵列)
EPF(EmbeddedProcessorForum,嵌入式处理器论坛)

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EPL(electronprojectionlithography,电子发射平版印刷)
EPM(EnhancedPowerManagement,增强形能源管理)
EPIC(explicitlyparallelinstructioncode,并行指令代码)
EUV(ExtremeUltraViolet,紫外光)
EUV(extremeultravioletlithography,极端紫外平版印刷)
FADD(FloationgPointAddition,浮点加)
FBGA(Fine-PitchBallGridArray,精细倾斜球状网阵排列)
FBGA(flipchipBGA,轻型芯片BGA)
FC-BGA(Flip-ChipBallGridArray,反转芯片球形栅格阵列)
FC-PGA(Flip-ChipPinGridArray,反转芯片针脚栅格阵列)
FDIV(FloationgPointDivide,浮点除)
FEMMS:FastEntry/ExitMultimediaState,快速进入/退出多媒体状态
FFT(fastFouriertransform,快速热欧姆转换)
FGM(Fine-GrainedMultithreading,高级多线程)
FID(FID:Frequencyidentify,频率鉴别号码)
FIFO(FirstInputFirstOutput,先入先出队列)
FISC(FastInstructionSetComputer,快速指令集计算机)
flip-chip(芯片反转)
FLOPs(FloatingPointOperationsPerSecond,浮点操作/秒)
FMT(fine-grainedmultithreading,纯消除多线程)
FMUL(FloationgPointMultiplication,浮点乘)
FPRs(floating-pointregisters,浮点寄存器)
FPU(FloatPointUnit,浮点运算单元)
FSUB(FloationgPointSubtraction,浮点减)
GFD(GoldfingerDevice,金手指超频设备)
GHC(GlobalHistoryCounter,通用历史计数器)
GTL(GunningTransceiverLogic,射电收发逻辑电路)
GVPP(GenericVisualPerceptionProcessor,常规视觉处理器)
HL-PBGA:表面黏著,高耐热、轻薄型塑胶球状网阵封装
HTT(Hyper-ThreadingTechnology,超级线程技术)
Hz(hertz,赫兹,频率单位)
IA(IntelArchitecture,英特尔架构)
IAA(IntelApplicationAccelerator,英特尔应用程序加速器)
ICU(InstructionControlUnit,指令控制单元)
ID(identify,鉴别号码)
IDF(IntelDeveloperForum,英特尔开发者论坛)
IEU(IntegerExecutionUnits,整数执行单元)
IHS(IntegratedHeatSpreader,完整热量扩展)
ILP(InstructionLevelParallelism,指令级平行运算)
IMM:IntelMobileModule,英特尔移动模块
InstructionsCache,指令缓存
InstructionColoring(指令分类)
IOPs(IntegerOperationsPerSecond,整数操作/秒)
IPC(InstructionsPerClockCycle,指令/时钟周期)
ISA(instructionsetarchitecture,指令集架构)
ISD(inbuiltspeed-throttlingdevice,内藏速度控制设备)
ITC(InstructionTraceCache,指令追踪缓存)
ITRS(InternationalTechnologyRoadmapforSemiconductors,国际半导体技术发展蓝图)
KNI(KatmaiNewInstructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(LightningDataTransport,闪电数据传输总线)
LFU(LegacyFunctionUnit,传统功能单元)
LGA(landgridarray,接点栅格阵列)
LN2(LiquidNitrogen,液氮)
LocalInterconnect(局域互连)
MAC(multiply-accumulate,累积乘法)
mBGA(MicroBallGridArray,微型球状网阵排列)
nm(namometer,十亿分之一米/毫微米)
MCA(machinecheckarchitecture,机器检查体系)
MCU(Micro-ControllerUnit,微控制器单元)
MCT(MemoryController,内存控制器)
MESI(Modified,Exclusive,Shared,Invalid:修改、排除、共享、废弃)
MF(MicroOpsFusion,微指令合并)
mm(micronmetric,微米)
MMX(MultiMediaExtensions,多媒体扩展指令集)
MMU(MultimediaUnit,多媒体单元)
MMU(MemoryManagementUnit,内存管理单元)
MN(modelnumbers,型号数字)
MFLOPS(MillionFloationgPoint/Second,每秒百万个浮点操作)
MHz(megahertz,兆赫)
mil(PCB或晶片佈局的長度單位,1mil=千分之一英寸)
MIPS(MillionInstructionPerSecond,百万条指令/秒)
MOESI(Modified,Owned,Exclusive,SharedorInvalid,修改、自有、排除、共享或无效)
MOF(MicroOpsFusion,微操作熔合)
Mops(MillionOperationsPerSecond,百万次操作/秒)
MP(Multi-Processing,多重处理器架构)

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MPF(MicroprocessorForum,微处理器论坛)
MPU(MicroprocessorUnit,微处理器)
MPS(MultiProcessorSpecification,多重处理器规范)
MSRs(Model-SpecificRegisters,特别模块寄存器)
MSV(MultiprocessorSpecificationVersion,多处理器规范版本)
NAOC(no-accountOverClock,无效超频)
NI(Non-Intel,非英特尔)
NOP(nooperation,非操作指令)
NRE(Non-RecurringEngineeringcharge,非重複性工程費用)
OBGA(OrganicBallGridArral,有机球状网阵排列)
OCPL(OffCenterPartingLine,远离中心部分线队列)
OLGA(OrganicLandGridArray,有机平面网阵包装)
OoO(OutofOrder,乱序执行)
OPC(OpticalProximityCorrection,光学临近修正)
OPGA(OrganicPinGridArray,有机塑料针型栅格阵列)
OPN(OrderingPartNumber,分类零件号码)
PAT(PerformanceAccelerationTechnology,性能加速技术)
PBGA(PlasticPinBallGridArray,塑胶球状网阵排列)
PDIP(PlasticDual-In-Line,塑料双重直线)
PDP(ParallelDataProcessing,并行数据处理)
PGA(Pin-GridArray,引脚网格阵列),耗电大
PLCC(PlasticLeadedChipCarriers,塑料行间芯片运载)
Post-RISC(加速RISC,或后RISC)
PR(PerformanceRate,性能比率)
PIB(ProcessorInaBox,盒装处理器)
PM(Pseudo-Multithreading,假多线程)
PPGA(PlasticPinGridArray,塑胶针状网阵封装)
PQFP(PlasticQuadFlatPackage,塑料方块平面封装)
PSN(ProcessorSerialnumbers,处理器序列号)
QFP(QuadFlatPackage,方块平面封装)
QSPS(QuickStartPowerState,快速启动能源状态)
RAS(ReturnAddressStack,返回地址堆栈)
RAW(ReadafterWrite,写后读)
REE(RapidExecutionEngine,快速执行引擎)
RegisterContention(抢占寄存器)
RegisterPressure(寄存器不足)
RegisterRenaming(寄存器重命名)
Remark(芯片频率重标识)
Resourcecontention(资源冲突)
Retirement(指令引退)
RISC(ReducedInstructionSetComputing,精简指令集计算机)
ROB(Re-OrderBuffer,重排序缓冲区)
RSE(registerstackengine,寄存器堆栈引擎)
RTL(RegisterTransferLevel,暫存器轉換層。硬體描述語言的一種描述層次)
SC242(242-contactslotconnector,242脚金手指插槽连接器)
SE(SpecialEmbedded,特别嵌入式)
SEC(SingleEdgeConnector,单边连接器)
SECC(SingleEdgeContactCartridge,单边接触卡盒)
SEPP(SingleEdgeProcessorPackage,单边处理器封装)
Shallow-trenchisolation(浅槽隔离)
SIMD(SingleInstructionMultipleData,单指令多数据流)
SiO2F(FluoridedSiliconOxide,二氧氟化硅)
SMI(SystemManagementInterrupt,系统管理中断)
SMM(SystemManagementMode,系统管理模式)
SMP(SymmetricMulti-Processing,对称式多重处理架构)
SMT(Simultaneousmultithreading,同步多线程)
SOI(Silicon-on-insulator,绝缘体硅片)
SOIC(PlasticSmallOutline,塑料小型)
SONC(Systemonachip,系统集成芯片)
SPGA(StaggeredPinGridArray、交错式针状网阵封装)
SPEC(SystemPerformanceEvaluationCorporation,系统性能评估测试)
SQRT(SquareRootCalculations,平方根计算)
SRQ(SystemRequestQueue,系统请求队列)
SSE(StreamingSIMDExtensions,单一指令多数据流扩展)
SFF(SmallFormFactor,更小外形格局)
SS(SpecialSizing,特殊缩放)
SSP(Slipstreamprocessing,滑流处理)
SST(SpecialSizingTechniques,特殊筛分技术)
SSOP(ShrinkPlasticSmallOutline,缩短塑料小型)
STC(SpaceTimeComputing,空余时间计算)
Superscalar(超标量体系结构)
TAP(TestAccessPort,测试存取端口)
TBGA(TieBallGridArray,带状球形光栅阵列)
TCP:TapeCarrierPackage(薄膜封装),发热小
TDP(ThermalDesignPower,热量设计功率)
Throughput(吞吐量)
TLB(TranslateLooksideBuffers,转换旁视缓冲器)
TLP(Thread-LevelParallelism,线程级并行)
TMP(ThreadedMulti-Path,线程多通道)

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TPI(TruePerformanceInitiative/index,真实性能为先/指标)
TQFP(ThinPlasticQuadFlatPack,薄型方面平面封装)
Trc(RowCycleTime,列循环时间)
TrD(TransistorDensity,晶体管密度)
TSOP(ThinSmallOutlinePlastic,薄型小型塑料)
USWC(UncacheabledSpeculativeWriteCombination,无缓冲随机联合写操作)
VALU(VectorArithmeticLogicUnit,向量算术逻辑单元)
VFSD(VertexFrequencyStreamDivider,顶点频率流分隔)
VID(VID:Voltageidentify,电压鉴别号码)
VLIW(VeryLongInstructionWord,超长指令字)
VPU(VectorPermutateUnit,向量排列单元)
VPU(vectorprocessingunits,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
VSA(VirtualSystemArchitecture,虚拟系统架构)
VTF(VIATechnicalForum,威盛技术论坛)
XBar(Crossbar,交叉口闩仲载逻辑单元)
XP(Experience,体验)
XP(Extraperformance,额外性能)
XP(eXtremePerformance,极速性能)

散热器
TFT(TinyFinTechnology,微型鳍片技术)

2、主板
3GIO(ThirdGenerationInput/Output,第三代输入输出技术)
ACR(AdvancedCommunicationsRiser,高级通讯升级卡)
ADIMM(advancedDualIn-lineMemoryModules,高级双重内嵌式内存模块)
AGTL+(AssistedGunningTransceiverLogic,援助发射接收逻辑电路)
AIMM(AGPInlineMemoryModule,AGP板上内存升级模块)
AMR(Audio/ModemRiser;音效/调制解调器主机板附加直立插卡)
AHA(AcceleratedHubArchitecture,加速中心架构)
AOI(AutomaticOpticalInspection,自动光学检验)
APU(AudioProcessingUnit,音频处理单元)
ARF(AsynchronousReceiveFIFO,异步接收先入先出)
ASF(AlertStandardsForum,警告标准讨论)
ASKIR(AmplitudeShiftKeyedInfra-Red,长波形可移动输入红外线)
AT(AdvancedTechnology,先进技术)
ATX(ATExtend,扩展型AT)
BIOS(BasicInput/OutputSystem,基本输入/输出系统)
CNR(CommunicationandNetworkingRiser,通讯和网络升级卡)
CSA(CommunicationStreamingArchitecture,通讯流架构)
CSE(ConfigurationSpaceEnable,可分配空间)
COAST(Cache-on-a-stick,条状缓存)
DASP(DynamicAdaptiveSpeculativePre-Processor,动态适应预测预处理器)
DB:DeviceBay,设备插架
DMI(DesktopManagementInterface,桌面管理接口)
DOT(DynamicOverclockingTechnonlogy,动态超频技术)
DPP(directprintProtocol,直接打印协议
DRCG(DirectRambusclockgenerator,直接RAMBUS时钟发生器)
DVMT(DynamicVideoMemoryTechnology,动态视频内存技术)
E(Economy,经济,或Entry-level,入门级)
EB(ExpansionBus,扩展总线)
EFI(ExtensibleFirmwareInterface,扩展固件接口)
EHCI(EnhancedHostControllerInterface,加强型主机端控制接口)
EISA(EnhancedIndustryStandardArchitecture,增强形工业标准架构)
EMI(ElectromagneticInterference,电磁干扰)
ESCD(ExtendedSystemConfigurationData,可扩展系统配置数据)
ESR(EquivalentSeriesResistance,等价系列电阻)
FBC(FrameBufferCache,帧缓冲缓存)
FireWire(火线,即IEEE1394标准)
FlexATX(FlexibilityATX,可扩展性ATX)
FSB(FrontSideBus,前端总线)
FWH(FirmwareHub,固件中心)
GB(Garibaldi架构,Garibaldi基于ATX架构,但是也能够使用WTX构架的机箱)
GMCH(Graphics&MemoryControllerHub,图形和内存控制中心)
GPA(GraphicsPerformanceAccelerator,图形性能加速卡)
GPIs(GeneralPurposeInputs,普通操作输入)
GTL+(GunningTransceiverLogic,发射接收逻辑电路)

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HDIT(HighBandwidthDifferentialInterconnectTechnology,高带宽微分互连技术)
HSLB(HighSpeedLinkBus,高速链路总线)
HT(HyperTransport,超级传输)
I2C(Inter-IC)
I2C(Inter-IntegratedCircuit,内置集成电路)
IBASES(IntelBaselineAGPSystemEvaluationSuite,英特尔基线AGP系统评估套件)
IC(integratecircuit,集成电路)
ICH(Input/OutputControllerHub,输入/输出控制中心)
ICH-S(ICH-HanceRapids,ICH高速型)
ICP(IntegratedCommunicationsProcessor,整合型通讯处理器)
IHA(IntelHubArchitecture,英特尔Hub架构)
IMB(InterModuleBus,隐藏模块总线)
INTIN(InterruptInputs,中断输入)
IPMAT(IntelPowerManagementAnalysisTool,英特尔能源管理分析工具)
IR(infraredray,红外线)
IrDA(infraredray,红外线通信接口,可进行局域网存取和文件共享)
ISA(IndustryStandardArchitecture,工业标准架构)
ISA(instructionsetarchitecture,工业设置架构)
K8HTB(K8HyperTransportBridge,K8闪电传输桥)
LSI(LargeScaleIntegration,大规模集成电路)
LPC(LowPinCount,少针脚型接口)
MAC(MediaAccessController,媒体存储控制器)
MBA(managebootagent,管理启动代理)
MC(MemoryController,内存控制器)
MCA(MicroChannelArchitecture,微通道架构)
MCH(MemoryControllerHub,内存控制中心)
MDC(MobileDaughterCard,移动式子卡)
MII(MediaIndependentInterface,媒体独立接口)
MIO(MediaI/O,媒体输入/输出单元)
MOSFET(metallicoxidesemiconductorfieldeffecttransistor,金属氧化物半导体场效应晶体管)
MRH-R(MemoryRepeaterHub,内存数据处理中心)
MRH-S(SDRAMRepeaterHub,SDRAM数据处理中心)
MRIMM(Media-RIMM,媒体RIMM扩展槽)
MSI(MessageSignaledInterrupt,信息信号中断)
MSPCE(MultipleStreamswithPipeliningandConcurrentExecution,多重数据流的流水线式传输与并发执行)
MT=MegaTransfers(兆传输率)
MTH(MemoryTransferHub,内存转换中心)
MuTIOL(Multi-ThreadedI/Olink,多线程I/O链路)
NGIO(NextGenerationInput/Output,新一代输入/输出标准)
NPPA(nForcePlatformProcessorArchitecture,nForce平台处理架构)
OHCI(OpenHostControllerInterface,开放式主控制器接口)
ORB(operationrequestblock,操作请求块)
ORS(OverReflowSoldering,再流回焊接,SMT元件的焊接方式)
P64H(64-bitPCIControllerHub,64位PCI控制中心)
PCB(printedcircuitboard,印刷电路板)
PCBA(PrintedCircuitBoardAssembly,印刷电路板装配)
PCI(PeripheralComponentInterconnect,互连外围设备)
PCISIG(PeripheralComponentInterconnectSpecialInterestGroup,互连外围设备专业组)
PDD(PerformanceDrivenDesign,性能驱动设计)
PHY(PortPhysicalLayer,端口物理层)
POST(PowerOnSelfTest,加电自测试)
PS/2(PersonalSystem2,第二代个人系统)
PTH(Plated-Through-Holetechnology,镀通孔技术)
RE(ReadEnable,可读取)
QP(Quad-Pumped,四倍泵)
RBB(RapidBIOSBoot,快速BIOS启动)
RNG(RandomnumberGenerator,随机数字发生器)
RTC(RealTimeClock,实时时钟)
KBC(KeyBroadControl,键盘控制器)
SAP(SidebandAddressPort,边带寻址端口)
SBA(SideBandAddressing,边带寻址)
SBC(singleboardcomputer,单板计算机)
SBP-2(serialbusprotocol2,第二代串行总线协协)
SCI(SerialCommunicationsInterface,串行通讯接口)
SCK(CMOSclock,CMOS时钟)
SDU(segmentdataunit,分段数据单元)

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SFF(SmallFormFactor,小尺寸架构)
SFS(SteplessFrequencySelection,步进频率选项)
SMA(ShareMemoryArchitecture,共享内存结构)
SMT(SurfaceMountedTechnology,表面黏贴式封装)
SPI(SerialPeripheralInterface,串行外围设备接口)
SSLL(SingleStreamwithLowLatency,低延迟的单独数据流传输)
STD(SuspendToDisk,磁盘唤醒)
STR(SuspendToRAM,内存唤醒)
SVR(SwitchingVoltageRegulator,交换式电压调节)
THT(ThroughHoleTechnology,插入式封装技术)
UCHI(UniversalHostControllerInterface,通用宿主控制器接口)
UPA(UniversalPlatformArchitecture,统一平台架构)
UPDG(UniversalPlatformDesignGuide,统一平台设计导刊)
USART(UniversalSynchronousAsynchronousReceiverTransmitter,通用同步非同步接收传送器)
USB(UniversalSerialBus,通用串行总线)
USDM(UnifiedSystemDiagnosticManager,统一系统监测管理器)
VID(VoltageIdentificationDefinition,电压识别认证)
VLB(VideoElectroniCsstandardsAssociationLocalBus,视频电子标准协会局域总线)
VLSI(VeryLargeScaleIntegration,超大规模集成电路)
VMAP(VIAModularArchitecturePlatforms,VIA模块架构平台)
VSB(VStandby,待命电压)
VXB(VirtualExtendedBus,虚拟扩展总线)
VRM(VoltageRegulatorModule,电压调整模块)
WE(WriteEnalbe,可写入)
WS(WaveSoldering,波峰焊接,THT元件的焊接方式)
XT(ExtendedTechnology,扩充技术)
ZIF(ZeroInsertionForce,零插力插座)

芯片组
ACPI(AdvancedConfigurationandPowerInterface,先进设置和电源管理)
AGP(AcceleratedGraphicsPort,图形加速接口)
BMS(BlueMagicSlot,蓝色魔法槽)
I/O(Input/Output,输入/输出)
MIOC:MemoryandI/OBridgeController,内存和I/O桥控制器
NBC:NorthBridgeChip(北桥芯片)
PIIX:PCIISA/IDEAccelerator(加速器)
PSE36:PageSizeExtension36-bit,36位页面尺寸扩展模式
PXB:PCIExpanderBridge,PCI增强桥
RCG:RAS/CASGenerator,RAS/CAS发生器
SBC:SouthBridgeChip(南桥芯片)
SMB(SystemManagementBus,全系统管理总线)
SPD(SerialPresenceDetect,连续存在检测装置)
SSB:SuperSouthBridge,超级南桥芯片
TDP:TritonDataPath(数据路径)
TSC:TritonSystemController(系统控制器)
QPA:QuadPortAcceleration(四接口加速)

主板技术
Gigabyte
ACOPS:AutomaticCPUOverHeatPreventionSystem(CPU过热预防系统)
SIV:SystemInformationViewer(系统信息观察)
磐英
ESDJ(EasySettingDualJumper,简化CPU双重跳线法)
浩鑫
UPT(USB、PANEL、LINK、TV-OUT四重接口)
华硕
C.O.P(CPUoverheatingprotection,处理器过热保护)

3、显示设备
AD(AnalogtoDigitalg,模拟到数字转换)
ADC(AppleDisplayConnector,苹果专用显示器接口)
ASIC(ApplicationSpecificIntegratedCircuit,特殊应用积体电路)
ASC(Auto-SizingandCentering,自动调效屏幕尺寸和中心位置)
ASC(AntiStaticCoatings,防静电涂层)
ASD(AutoStereoscopicDisplay,自动立体显示)
AGC(AntiGlareCoatings,防眩光涂层)
AG(ApertureGrills,栅条式金属板)
ARC(AntiReflectCoating,防反射涂层)
BLA:BearnLandingArea(电子束落区)
BMC(BlackMatrixScreen,超黑矩阵屏幕)
CCS(CrossCapacitanceSensing,交叉电容感应)
cd/m^2(candela/平方米,亮度的单位)
CDRS(CurvedDirectionalReflectionScreen,曲线方向反射屏幕)
CG-Silicon(ContinuousGrainSilicon,连续微粒硅)
CNT(carbonnano-tube,碳微管)
CRC(CyclicalRedundancyCheck,循环冗余检查)
CRT(CathodeRayTube,阴极射线管)
CVS(ComputeVisualSyndrome,计算机视觉综合症)
DA(DigitaltoAnalog,数字到模拟转换)
DDC(DisplayDataChannel,显示数据通道)

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DDWG(DigitalDisplayWorkingGroup,数字化显示工作组)
DEC(DirectEtchingCoatings,表面蚀刻涂层)
DeflectionCoil(偏转线圈)
DFL(DynamicFocusLens,动态聚焦)
DFP(DigitalFlatPanel,数字平面显示标准)
DFPG(DigitalFlatPanelGroup,数字平面显示标准工作组)
DFS(DigitalFlexScan,数字伸缩扫描)
DIC:DigitalImageControl(数字图像控制)
DigitalMultiscanII(数字式智能多频追踪)
DLP(digitalLightProcessing,数字光处理)
DOSD:DigitalOnScreenDisplay(同屏数字化显示)
DPMS(DisplayPowerManagementSignalling,显示能源管理信号)
DotPitch(点距)
DQL(DynamicQuadrapoleLens,动态四极镜)
DSP(DigitalSignalProcessing,数字信号处理)
DSTN(DoublelayersSuperTwistedNematic,双层超扭曲向列,无源矩阵LCD)
DTV(DigitalTV,数字电视)
DVI(DigitalVisualInterface,数字化视像接口)
ECD(ElectroChromicDisplay,电铬显示器)
EFEAL(ExtendedFielDELLipticalApertureLens,可扩展扫描椭圆孔镜头)
FED(FieldEmissionDisplays,电场显示器)
FlybackTransformer(回转变压器)
FPD(flatpaneldisplay,平面显示器)
FRC:FrameRateControl(帧比率控制)
GLV(grating-light-valve,光栅亮度阀)
HDMI(HighDefinitionMultimediaInterface,高精度多媒体接口)
HDTV(highdefinitiontelevision,高清晰度电视)
HVD(HighVoltageDifferential,高分差动)
IFT(InfiniteFlatTube,无限平面管,三星丹娜)
INVAR(不胀铜)
IPS(in-planeswitching,平面开关)
LCD(liquidcrystaldisplay,液晶显示屏)
LCOS:LiquidCrystalOnSilicon(硅上液晶)
LED(lightemittingdiode,光学二级管)
L-SAGIC(LowPower-SmallApertureG1wihtImpregnatedCathode,低电压光圈阴极管)
LTPS(Low-TemperaturePoly-Si,低温多晶硅)
LVD(LowVoltageDifferential,低分差动)
LVDS(LowVoltageDifferentialSignal,低分差动信号)
LRTC(LCDResponseTimeCompensation,液晶响应时间补偿)
LTPS(LowTemperaturePolysilicon,低温多硅显示器)
MALS(MultiAstigmatismLensSystem,多重散光聚焦系统)
MDA(MonochromeAdapter,单色设备)
MonochromeMonitor(单色显示器)
MS:MagneticSensors(磁场感应器)
MVA(multi-domainverticalalignment,广域垂直液晶队列)
OEL(organicelectro-luminescent,有机电镀冷光)
OLED(Organiclight-emittingdiode,有机电激发光显示器)
OSD(OnScreenDisplay,同屏显示)
PAC(psycho-acousticcompensation,心理声学补偿)
P&D(PlugandDisplay,即插即显)
PDP(PlasmaDisplayPanel,等离子显示器)
PorousTungsten(活性钨)
PPI(PixelPerInch,像素/英寸)
RGB(Red、Blue、Green,红、蓝、绿三原色)
ROP(rasteroperations,光栅操作)
RSDS:ReducedSwingDifferentialSignal(小幅度摆动差动信号)
SC(ScreenCoatings,屏幕涂层)
SingleEnded(单终结)
ShadowMask(点状阴罩)
SXGA(SupereXtendedGraphicsArray,超级扩展型图形阵列)
STN(SuperTwistedNematic,超扭曲向列,无源矩阵)
TCO(TheSwedishConfederationofProfessionalEmployees,瑞典专业工作人员联合会)
TDT(TimeingDetectionTable,数据测定表)
TMDS(TransitionMinimizedDifferentialSignaling,转换极低损耗微分信号)
TN(TwistedNematic,扭曲液晶向列,无源矩阵LCD)
TN+film(twistednematicandretardationfilm,扭曲液晶向列+延迟薄膜)
TICRG:TungstenImpregnatedCathodeRayGun(钨传输阴级射线枪)
TFT(thinfilmtransistor,薄膜晶体管,有源矩阵LCD)
Trinitron(特丽珑)
UCC(UltraClearCoatings,超清晰涂层)
UFB(Ultra-Fine&Bright,新概念超亮度液晶显示屏)
UXGA(UltraExtendedGraphicsArray,极速扩展图形阵列)
VAGP:VariableAperatureGrillePitch(可变间距光栅)
VBI:VerticalBlankingInterval(垂直空白间隙)
VESA(VideoElectronicsStandardsAssociation,视频电子标准协会)
VGA(videographicsarray,视频图像阵列)
VDT(VideoDisplayTerminals,视频显示终端)
VRR:VerticalRefreshRate(垂直扫描频率)

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VW(VirtualWindow,虚拟视窗)
XGA(eXtendedGraphicsArray,扩展型图形阵列)
YUV(亮度和色差信号)

4、视频
3D:ThreeDimensional,三维
3DCG(3Dcomputergraphics,三维计算机图形)
3DS(3DSubSystem,三维子系统)
A-Buffer(AccumulationBuffer,积聚缓冲)
AA(AccuviewAntialiasing,高精度抗锯齿)
ADC(AnalogtoDigitalConverter,模数传换器)
ADI(AdaptiveDe-Interlacing,自适应交错化技术)
AE(AtmosphericEffects,大气雾化效果)
AFC(AdvancedFrameCapture、高级画面捕获)
AFR(AlternateFrameRendering,交替渲染技术)
AnisotropicFiltering(各向异性过滤)
APPE(AdvancedPacketParsingEngine,增强形帧解析引擎)
AR(Auto-Resume,自动恢复)
AST(amorphous-siliconTFT,非晶硅薄膜晶体管)
AV(AnalogVideo,模拟视频)
AV(Audio&Video,音频和视频)
BSplines(B样条)
BAC(BadAngleCase,边角损坏采样)
BackBuffer,后置缓冲
Backfaceculling(隐面消除)
BattleforEyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)
BilinearFiltering(双线性过滤)
B.O.D.E(Body、Object、Design、Envioment,人体、物体、设计、环境渲染自动识别)
BSP(BinarySpacePartitioning,二进制空间分区)
CBMC(Crossbarbasedmemorycontroller,内存控制交叉装置)
CBU(colorblendingunit,色彩混和单位)
CEA(CriticalEdgeAngles,临界边角)
CEM(cubeenvironmentmapping,立方环境映射)
CG(CforGraphics/GPU,用于图形/GPU的可编程语言)
CG(ComputerGraphics,计算机生成图像)
Clipping(剪贴纹理)
ClockSynthesizer,时钟合成器
compressedtextures(压缩纹理)
ConcurrentCommandEngine,协作命令引擎
CSC(ColorspaceConversion,色彩空间转换)
CSG(constructivesolidgeometry,建设立体几何)
CSS(ContentScramblingSystem,内容不规则加密)
DAC(DigitaltoAnalogConverter,数模传换器)
DCD(DirectionalCorrelationalDe-interlacing,方向关联解交错)
DCT(DisplayCompressionTechnology,显示压缩技术)
DDC(DynamicDepthCueing,动态深度暗示)图像
DDP(DigitalDisplayPort,数字输出端口)
DDS(DirectDrawSurface,直接绘画表面)
Decal(印花法,用于生成一些半透明效果,如:鲜血飞溅的场面)
DFP(DigitalFlatPanel,数字式平面显示器)
DFS:DynamicFlatShading(动态平面描影),可用作加速
Dithering(抖动)
DirectionalLight,方向性光源
DM(Displacementmapping,位移贴图)
DME(DirectMemoryExecute,直接内存执行)
DOF(DepthofField,多重境深)
dottextureblending(点型纹理混和)
DOT3(Dotproduct3bumpmapping,点乘积凹凸映射)
DoubleBuffering(双缓冲区)
DPBM(DotProductBumpMapping,点乘积凹凸映射)
DQUICK(DVDQualificationandIntegrationKit,DVD资格和综合工具包)
DRA(deferredrenderingarchitecture,延迟渲染架构)
DRI(DirectRenderingInfrastructure,基层直接渲染)
DSP(DualStreamsProcessor,双重流处理器)
DVC(DigitalVibranceControl,数字振动控制)
DVI(DigitalVideoInterface,数字视频接口)
DVMT(DynamicVideoMemoryTechnology,动态视频内存技术)
DxR:DynamicXTendedResolution(动态可扩展分辨率)
DXTC(directxTextureCompress,DirectX纹理压缩,以S3TC为基础)
DynamicZ-buffering(动态Z轴缓冲区),显示物体远近,可用作远景
E-DDC(EnhancedDisplayDataChannel,增强形视频数据通道协议,定义了显示输出与主系统之间的通讯通道,能提高显示输出的画面质量)
EdgeAnti-aliasing(边缘抗锯齿失真)
E-EDID(EnhancedExtendedIdentificationData,增强形扩充身份辨识数据,定义了电脑通讯视频主系统的数据格式)
eFB(embeddedFrameBuffer,嵌入式帧缓冲)
eTM(embeddedTextureBuffer,嵌入式纹理缓冲)
ExecuteBuffers,执行缓冲区
Embosing,浮雕
EMBM(environmentmappedbumpmapping,环境凹凸映射)
ExtendedBurstTransactions,增强式突发处理
FactorAlphaBlending(因子阿尔法混合)
FastZ-clear,快速Z缓冲清除

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FB(fragmentbuffer,片段缓冲)
FL(fragmentlist,片段列表)
FW(FastWrite,快写,AGP总线的特殊功能)
FrontBuffer,前置缓冲
Flat(平面描影)
FL(FunctionLookup,功能查找)
FMC(FrictionlessMemoryControl,无阻内存控制)
FramesrateiSKINg(帧数为王)
FRC(FrameRateControl,帧率控制)
FSAA(FullScene/ScreenAnti-aliasing,全景/屏幕抗锯齿)
Fog(雾化效果)
flipdoublebuffered(反转双缓存)
fogtablequality(雾化表画质)
F-Buffer(FragmentStreamFIFOBuffer,片段流先入先出缓冲区)
GPT(GraphicsPerformanceToolkit,图形性能工具包)
FRJS(FullyRandomJitteredSuper-Sampling,完全随机移动式超级采样)
Fur(软毛效果)
GART(GraphicAddressRemappngTable,图形地址重绘表)
GI(GlobalIllumination,球形光照)
GIC(GoldImmersionCoating,化金涂布技术,纯金材质作为PCB最终层,提升信号完整性)
GIF(GraphicsInterchangeFormat,图像交换格式)
GouraudShading,高洛德描影,也称为内插法均匀涂色
GPU(GraphicsProcessingUnit,图形处理器)
GTF(GeneralizedTimingFormula,一般程序时间,定义了产生画面所需要的时间,包括了诸如画面刷新率等)
GTS(GigaTextelSharder,十亿像素填充率)
GuardBandSupport(支持保护带)
HAL(HardwareAbstractionLayer,硬件抽像化层)
HDR(HighDynamicRange,高级动态范围)
HDRL(highdynamic-rangelighting,高动态范围光线)
HDVP(High-DefinitionVideoProcessor,高精度视频处理器)
HEL:HardwareEmulationLayer(硬件模拟层)
HLSL(HighLevelShadingLanguage,高级描影语言)
HMC(hardwaremotioncompensation,硬件运动补偿)
HierarchicalZ(Z分级)
hightrianglecount(复杂三角形计数)
HOS(Higher-OrderSurfaces,高次序表面)
HPDR(High-PrecisionDynamic-Range,高精度动态范围)
HRAA(HighResolutionAnti-aliasing,高分辨率抗锯齿)
HSI(HighSpeedInterconnect,高速内连)
HSR(HiddenSurfAceremoval,隐藏表面移除)
HTP(HyperTexelPipeline,超级像素管道)
HWMC(HardwareMotionCompensation,硬件运动补偿)
ICD(InstallableClientDriver,可安装客户端驱动程序)
iDCT(inverseDiscreteCosineTransformation,负离散余弦转换)
IDE(IntegratedDevelopmentEnvironment,集成开发环境)
ImmediateMode,直接模式
IMMT(IntelligentMemoryManagerTechnology,智能内存管理技术)
Imposters(诈欺模型)
IPEAKGPT(IntelPerformanceEvaluationandAnalysisKit-GraphicsPerformanceToolkit,英特尔性能评估和分析套件-图形性能工具包)
IPPR:ImageProcessingandPatternRecognition(图像处理和模式识别)
IR(ImmediateRendering,直接渲染)
IRA(immediate-moderenderingarchitecture,即时渲染架构)
IQ(inversequantization,反转量子化)
ITC(InternalTrueColor,内部真彩色)
IVC(IndexedVertexCache,索引顶点缓存)
JFAA(JitterFreeAntiAliasing,自由跳跃进抗锯齿)
JGSS(JitteredGridSuper-Sampling,移动式栅格超级采样)
JPRS(Jitteredpseudorandomsampling,抖动假取样)
KeyFrameInterpolation,关键帧插补
largetextures(大型纹理)
LE(lowend,低端)
LF(LinearFiltering,线性过滤,即双线性过滤)
LFB(LinearFrame-Buffer,线性帧缓冲)
LFM(LightFieldMapping,光照区域贴图)
lighting(光源)
lightmap(光线映射)
LMA(LightspeedmemoryArchitecture,光速内存架构)
LocalPeripheralBus(局域边缘总线)
LOD(Levels-of-Detail,细节级)
LosslessZCompression,无损Z压缩
LPF(Low-pastfilter,低通道滤波器)
LSR(LightShaftRendering,光线轴渲染)
mipmapping(MIP映射)
MAC(MediocreAngleCase,普通角采样)
MatrixVertexBlending,矩阵顶点混和
MCM(MultichipModule,多芯片模块)
Membranelighting,隔膜光线
MipmapLODBiasAdjustment(映射LOD偏移调节)
Modulate(调制混合)
MotionCompensation,动态补偿

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